[Source: Gaogong LED's "LED Good Products" March 2015 issue (total issue 63) Wen|Gan Qin] In recent years, Gujing solder paste has been active in the field of LED packaging due to its good thermal conductivity and cost advantages. The industry pointed out that with the continuous improvement of technology, the appearance of solder paste is expected to replace the existing conductive silver paste and thermal adhesive.

It is understood that if the price comparison of two kinds of solid crystal materials is made, the solder paste is at least half cheaper than the silver glue. According to the investigation of the reporter, the price of silver glue is about 45 yuan / g, and the price of solid crystal solder paste is about 20 yuan / g.

The morning technical and technical director Wang Benzhi made a comparison based on the usage time of the two. “The use time of silver glue exceeds 8 hours and requires scrap treatment. The viscosity of the solid crystal solder paste can be adjusted according to the equipment requirements. According to each solid crystal machine 50K The capacity of each shift is calculated, and the rubber disc is cleaned once per shift (about 1g remains), and the solid crystal solder paste can be collected and reused.

However, since the solder paste itself contains a certain proportion of flux, there is flux residue during the process, so the solid crystal solder paste has a need for cleaning.

“The flux residue of the solder paste during the process may affect the reliability of the product.” Hu Shuangneng, director of the marketing department of Getian Optoelectronics, said, “Although there is no-clean flux on the market, the no-clean flux does not mean not to clean. It is only relatively less residue."

“The flux remaining in the solder paste is something similar to the rosin property. It is an active material and its heat resistance is not very good. For the high temperature eutectic technology, the residue of the solder paste will have an impact on the aging process. Weng Ping, director of Hongli Optoelectronics Engineering Technology Center, said that if silver paste made of mixed silver powder of phenyl or methyl is sufficient heat resistance, it will not appear yellow or ash.

In Weng Ping's view, the cleaning process of the solder paste increases the labor cost; on the other hand, since the solder paste is still inevitable after the cleaning, it does not save time.

As for whether tin paste can replace silver glue, Weng Ping said, “As the flip-chip process has matured in recent years, the use of solder paste in the field of flip-chip is gradually increasing, but the proportion is not very high in terms of market acceptance. After all, the cost of flipping has not yet fallen to the PK dress. Silver glue is a relatively mature material after all, so whether solder paste can replace silver glue is still unknown."

Comparison of solid crystal cost per unit of 100K (partial project)


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