On December 14, 2012, Gaogong LED Conference was grandly opened at the Mission Hills Golf Club (Dongguan Club) in Shenzhen. The conference included the 2nd G20-LED Summit 2nd Meeting, the CEO Summit of the Upper, Middle and Lower reaches, 2012. High-tech Golden Globe Awards Vote and Awards Ceremony, Gaogong LED Four-Year Celebration Gala and 2012 (Lianchuang Cup) Gaogong LED-CEO Golf Invitational.

After the second closed meeting of the 2nd G20-LED Summit on the morning of December 14, the 2012 High-tech LED Conference-Upper Middle and Lowerstream CEO Summit was officially launched in the afternoon at the Mission Hills International Conference Center in Shenzhen, including the G20 Summit member companies. The CEOs of more than 300 LED companies at home and abroad have jointly discussed the LED industry development, corporate strategy, market strategy and industrial chain cooperation plan, and the scale of the lineup is unprecedented.


Gong Weibin, general manager of Shenzhen Ruifeng Optoelectronics Co., Ltd. said in a keynote speech that LED upstream is a core technology plus capital-intensive field. According to the rules of the semiconductor industry, there will not be many companies that can survive in the future competition. "At present, the semiconductor chip industry in the mainland does not actually make money. In fact, there are one or two companies with government backgrounds that are not particularly profitable now. The competition is fierce, and the core technology requires a lot of capital investment. Not a particularly fun thing."

However, Gong Weibin believes that there may be some variables from the technical point of view. The first is the substrate technology. At present, the international manufacturers have made breakthroughs in this area, including Puri, Toshiba and TSMC, which can change the upstream pattern; GaN substrate technology, Nakamura Yuji and Nichia Chemical of Japan, this technology will be of great help to the improvement of light efficiency, and there are also researches of related companies in China, such as Dehao Runda and New Century Optoelectronics, mainly Crystal and flip chip.


In addition, there may be more or less variables at the capital level. Domestic Sanan and Jingdian will have lower competition. TSMC and Puri have large financing systems and large variables, while Samsung and Nichia are responsible for the entire industry. The drive may also have some changes. "Whoever makes money and who loses money is the core technology in the long run. In the short run, it is the support of the government. Of course, the government will not spawn a truly excellent company. To make money, it is necessary to spend more on the technical level." ”

"In the downstream application field, the main performance is N=N+ 1 mode, that is to say, there are not many ones and one less, but I think that if you work hard in a market segment, there is still a great chance." Gong Weibin It is pointed out that in a market environment where there is no standard and technology changes very fast, the price of products drops by 30%-50% per year, and the general channels are difficult to survive. In terms of domestic sales, enterprises basically rely on engineering and government support, and they want to fight for more in the future. More market space, we must build brand channels on this basis.

In the field of midstream packaging, Gong Weibin emphasized that the future must rely on technology that can bring new changes to the industry. One is ceramic technology, Ruifeng has made progress in this area, and the other is based on glass substrate packaging technology. The data coming out is 200, and there is a bigger revolution - EIC technology, which is the package-free technology, will have a greater impact on the future of the midstream.

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